TSSOP16, 4.4x5 EXPOSED PAD

CASE 948BV

ISSUE O

DATE 22 JUN 2017

TOP VIEW

BOTTOM VIEW

END VIEW

SIDE VIEW

LAND PATTERN

Notes:

(1) All dimensions are in millimeters. Angles in degrees.

(2) Complies with JEDEC MO-153 variations ABT.

SYMBOL

MIN

NOM

MAX

θ

A

A1

A2

b

c

D

E

E1

e

L1

0º

8º

L

0.05

0.85

0.19

0.13

0.45

4.90

6.30

4.30

0.65 BSC

1.00 REF

1.10

0.15

0.95

0.30

0.20

0.75

5.10

6.50

4.50

N

P

R

S

0.90

6.50

4.60

0.37

1.00

6.70

4.80

0.47

X

Y

3.33 REF

2.76 REF

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

onsemi and

are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves

the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular

purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation

special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.

98AON65408G

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

TSSOP16, 4.4X5 EXPOSED PAD

© Semiconductor Components Industries, LLC, 2017

www.onsemi.com