NCV78514

www.onsemi.com

3

PIN OUT DESCRIPTION

Figure 3. Pin Out (Top View)

BAT

BAT

LSSG

DIM

AGND

VDD

RSV

VDRV

VBOOT

ISET

PGND

SW

SNSN

SNSP

TCS

SW

Exposed Pad

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

Table 1. PIN FUNCTION DESCRIPTION

Number

Name

Description

1, 2

BAT

Input supply voltage, coming from the Battery or ECU, through reverse blocking protection and input

Pi filter. Pin 1 and pin 2 must be connected together.

3

DIM

Enable/disable function, including LED current dimming function and error status function.

4

AGND

Must be connected directly to the analog ground plane.

5

VDD

3V3 low dropout output pin. A capacitor must be connected between this pin and ground.

Must not be used for external load.

6

RSV

Reserved for production test. Must be connected directly to the analog ground plane in the

application.

7

VDRV

VDRV regulator output for the external gate driver. A capacitor must be connected between this pin

and ground. Must not be used for external load.

8

LSSG

Gate drive of the boost, low side NMOS.

9

SNSN

Voltage feedback of the current sense, LED side

10

ISET

LED current−encoding resistor connection (RSET connection or VSET voltage).

11

SNSP

Voltage feedback of the current sense, H−Bridge side

12

TCS

Temperature coefficient sensor connection. Compatible with both NTC and PTC sensors.

13

VBOOT

Bootstrap pin.

14

PGND

Power ground.

15, 16

SW

Switching node for the inductor connection. Pin 15 and pin 16 must be connected together.

Exposed pad

ExP

Thermal Pad for power dissipation. Must be connected to the power ground local plane for noise

optimization.