Data Sheet

ADA4620-1, ADA4620-2

analog.com

Rev. 0

10 of 49

ABSOLUTE MAXIMUM RATINGS

TA = 25°C unless otherwise specified.

Table 3. Absolute Maximum Ratings

PARAMETER

RATING

Supply Voltage ((V+) − (V−))

40 V

Input Voltage Single-Ended

(V−) − 0.3 V to (V+) + 0.3 V

Input Voltage Differential

((V+) − (V−)) + 0.6 V

Output Voltage (VOUT)

(V−) − 0.3 V to (V+) + 0.3 V

Input Current (I+IN, I−IN)

20 mA

Output Short-Circuit Duration1

Continuous

Storage Temperature

−65 °C to +150 °C

Operating Temperature

−40 °C to +125 °C

Junction Temperature

−65 °C to +150 °C

Lead Temperature Soldering, 10 s

300°C

.

1

A heatsink may be required to keep the TJ below the absolute maximum rating when the output is shorted

indefinitely.

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These

are stress ratings only, functional operation of the product at these or any other conditions above those indicated in

the operational section of this specification is not implied. Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

Thermal Characteristics

Thermal performance is directly linked to the PCB design and operating environment. Close attention to PCB

thermal design is required.

JA is the junction-to-ambient thermal resistance.

JC is the junction-to-case thermal resistance.

Table 4. Thermal Resistance

Package Type

JA

JC

Unit

ADA4620-1

SOIC_N (R-8)

115.5

46.3

C/W

ADA4620-2

SOIC_N (R-8)

110.1

47.5

C/W

Maximum Power Dissipation

The maximum safe power dissipation in the ADA4620 SOIC-8 package is limited by the associated rise in junction

temperature (TJ) on the die. The plastic encapsulating the die locally reaches the junction temperature. At

approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily