ADA4620-1ARZ-R7 datasheet(12/49 Pages) AD

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Data Sheet

ADA4620-1, ADA4620-2

analog.com

Rev. 0

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Figure 3. Maximum Power Dissipation vs. Temperature

Airflow increases heat dissipation, effectively reducing θJA. Also, more metal directly in contact with the package

leads from metal traces, through holes, ground, and power planes reduce the θJA.

Figure 3 shows the maximum safe power dissipation in the package vs. the ambient temperature for the SOIC-8

(125°C/W) package on a JEDEC standard 4-layer board. θJA values are approximations.

Electrostatic Discharge (ESD) Ratings

The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field-induced charged device model (FICDM) and charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for AD4620-1

Table 5. ADA4620-1, 8-Lead SOIC_N (R-8)

ESD Model

Withstand Threshold (V)

Class

HBM

±1750

FICDM

±1000

ESD Ratings for AD4620-2

Table 6. ADA4620-2, 8-Lead SOIC_N (R-8)

ESD Model

Withstand Threshold (V)

Class

HBM

±1500

FICDM

±1000

ESD Caution

ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can

discharge without detection. Although this product features patented or proprietary

protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore,

proper ESD precautions should be taken to avoid performance degradation or loss of

functionality.

ADA4620-1, SOIC-8

ADA4620-2, SOIC-8

AMBIENT TEMPERATURE (°C)

–60

–40

–20

100

120

140

0.5

1.0

1.5

2.0

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