PCA9673_1

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 01 — 1 February 2007

27 of 33

NXP Semiconductors

PCA9673

Fig 33. Package outline SOT815-1 (DHVQFN24)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

SOT815-1

- - -

- - -

- - -

03-04-29

SOT815-1

0

2.5

5 mm

scale

b

y

y1 C

C

A

C

C

B

e1

e2

terminal 1

index area

terminal 1

index area

X

UNIT

max.

bc

e

L

y

w

v

mm

1

0.05

0.00

0.30

0.18

0.5

4.5

1.5

0.2

2.25

1.95

4.25

3.95

0.05

0.05

0.1

0.1

DIMENSIONS (mm are the original dimensions)

0.5

0.3

5.6

5.4

3.6

3.4

D

E

B

A

e

DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package;

no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm

A

A1

c

detail X

Eh

L

Dh

2

23

11

14

13

12

1

24