data sheet

Features:

Package

Options:

Reliability:

WAFER LEVEL PACKAGING

www.amkor.com

• 4-64 ball count

• 0.8 mm - 4.5 mm body size

• Repassivation, Redistribution and Bumping options available

• Electroplated and Ball-loaded bumping options

• Eutectic, High Lead and Lead-free solder

• Standard JEDEC/EIAJ pitches and CSP solder ball diameters

• Compatible with conventional SMT assembly and test techniques

• Back-side laser mark compatible

• Back-side laminate

• Impressive component and board level reliability

• Cost effective packaging solution for small ICs

• No need for underfill

• Full turnkey bumping, test and TnR support

• Ship to customer in either wafer form or singulated form

Ball Loading:

Pitch

Sphere Diameter

0.40 mm

0.25 mm

0.50 mm

0.30 mm, 0.35 mm

0.65 mm

0.35 mm

0.75 mm

0.50 mm

Package Level:

• Autoclave (PCT)

121°C/100% RH/15 psig, 96 hours

• Temp Cycle

-55°C/+125°C, 500 cycles

• High Temp storage 170°C, 420 hours

Second Level Reliability (BLR):

• HAST

130°C/85%RH/33.5psia/Biased, 96 hours

• HTOL

150°C/Biased, 300 hours

• Temp Cycle -40°C/+125°C, 1000 cycles

• Key Push

100cycles/min, 2.7mm max displacement

• Bend Test

Strain rate 5mm/min, 85mm span

• Drop Test

50cm height

Amkor's wafer level packaging service meets the industry's

growing demand for full turnkey assembly and test solu-

tions for CSP (Chip Scale Package) products. Through the

sents the next level in wafer level chip scale packaging as

demonstrated by its proven benchmark reliability. Amkor's

for cost effective, reliable, high performance wafer level

technology with existing die processing and testing servic-

es as well as new die processing technologies developed by

Unitive, Amkor is able to offer a full turnkey solution for

wafer level products.

porate thin film redistribution films to route I/O pads to

JEDEC/EIAJ standard pitches, and thereby, avoiding the

need to redesign legacy parts for CSP applications. It is

available in three options: Direct Bump on Pad (BOP),

Bump on Repassivation/Redistribution and Bump on Thick

Repassivation/Redistribution. The technology used for

lize industry-standard surface mount assembly and reflow

techniques. By using conventional SMT placement equip-

ment and avoiding the need for underfill, the end-user

experiences many of the cost benefits associated with other

JEDEC standard area array packages.

Amkor's wafer bumping and test offering is an excellent

complement to other Amkor product lines. Through an

integrated die processing service, Amkor is able to provide

full turnkey wafer bumping, test, die singulation, and tape

& reel support for wafer level packaging applications. In

addition, Amkor is able to integrate its wafer bumping

products into high performance packaging options, such as

Flip Chip CSP (fcCSP) and System in Package (SiP). Amkor

truly provides one-stop, hassle-free support for wafer

bumping, packaging, and test solutions, enabling you to

meet your cost and time-to-market objectives.

DS720A

Rev Date: 12’05

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

.

Applications:

cations that require a low cost packaging solution with small form fac-

tor and improved signal propagation characteristics. EEPROM, flash,

DRAM, integrated passive networks, and standard analog devices are all

products include mobile phones, PDAs, laptop PCs, disk drives, digital

cameras, MP3 players, GPS navigation devices, and other portable prod-

ucts.