data sheet

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or

damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard

terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.

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Process Highlights

Die thickness

0.27mm - 0.45 mm

Redistribution

Bump height

Solder ball pitch

0.50 mm (typ.), 0.40 mm (optional)

Visual inspection

Wafer map output

Standard Materials

Dielectric material

Polyimide

RDL

Copper

UBM

Ti/Cu/Ni, TiW/Cu/Ni

Solder Composition

Ball Loaded:

Pb-Free (Sn/3.9Ag/0.6Cu), Eutectic (63Sn/37Pb),

High Pb (5Sn/95Pb)

Electroplated:

Pb-Free (97.5Sn/2.5Ag), Eutectic (63Sn/37Pb),

High Pb (5Sn/95Pb)

Test Services

in reduced cost and improved cycle-time for the customer.

Shipping

magazines or may be singulated for shipment in tape or tray.

WAFER LEVEL PACKAGING

Direct Bump on Pad with Repassivation

Bump on Repassivation/Redistribution

Design

•

Layout

•

Mask tooling

Manufacturing

•

Thin film dielectric and metal patterning

•

Wafer bumping (electroplated and sphere placement)

•

Automated visual inspection

•

Wafer map generation

Test

•

Test software and hardware development

•

Probe card design, service, and support

•

Test program transfer

•

Wafer sort for memory, logic, and analog applications

Die Processing Integration

and Support

•

Wafer saw

•

Visual inspection

•

Wafer map integration

•

PnP to tape or tray

•

Shipping material design and supply management

•

Turnkey solutions

•

Drop ship to final customer

Capabilities and Services

Bump on Thick Repassivation/Redistribution