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SAM9X75-SIP 数据表(PDF) 28 Page - Microchip Technology |
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SAM9X75-SIP 数据表(HTML) 28 Page - Microchip Technology |
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28 / 36 page ![]() SAM9X75 SiP Mechanical Characteristics Data Sheet © 2023 Microchip Technology Inc. and its subsidiaries DS60001827B - 28 Table 7-1. 243-ball TFBGA Package Characteristics Moisture sensitivity level MSL3 Table 7-2. Device and 243-ball TFBGA Package Weight 520 mg Table 7-3. Package Reference JEDEC drawing reference NA J-STD-609 classification e8 Table 7-4. 243-ball TFBGA Package Information Ball land 0.450 mm Nominal ball diameter 0.400 mm Solder mask opening 0.350 mm Solder mask definition Solder Mask Defined (SMD) Solder SAC105 |
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