data sheet

CLGA

Features:

CERAMIC

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Ceramic Land Grid Array

Package (CLGA)

This surface mount package is the same as the

Ceramic Pin Grid Array, except that the pins are

replaced by pads. This package consists of a

co-fired ceramic base that has a matrix of pads on

the bottom of the base. The lid for this package

can be either ceramic "frit sealed" or metal "solder

sealed". This IC package technology allows

application and design engineers to maximize the

performance characteristics of semiconductors

(silicon & GaAs). CLGAs are designed for low

inductance, enhanced thermal operation and

capability. Custom performance enhancements are

available for significant improvements in electrical

response demanded by advancing electronics.

Applications:

Semiconductor technologies find enhanced

performance by using the integrated design

features of the CLGA package. Microprocessors /

controllers, ASICs, Gate Arrays, memory, DSPs and

PC chip sets find the CLGA family to be an ideal

package. Applications requiring improved thermal

performance and high-speed performance such as

desk PCs, laptop PC's, and other similar products

benefit from the CLGA attributes.

The CLGA offers a variety of feature. From

innovative designs and expanding package

offerings, Amkor provides a platform from

prototype-to-production.

•

Flexible land grid array lead counts

•

Variety of body sizes

•

50 mil staggered & 100 mil matrix land

grid pitch

•

Heat plate / heat slug / heat sink

•

Exceptional thermal and electrical

performance by design

•

Multi-layer, ground / power

•

Cavity package

DS803

Rev Date: 08’02

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