fcCSP

LAMINATE

Process Highlights

Die size (max)

Pkg size - 1 mm

Bump pitch (min)

Pkg size - 1 mm

In-line

150

µm

Minimum array

250

µm

Standard Materials

Package substrate

Hitachi FR5 E679 / BT

Bump

63/37 Sn/Pb

Encapsulant

Epoxy mold compound

Solder balls

Eutectic SnPb

Test Services

• Program generation/conversion

• Product engineering

• Wafer sort

• -55 °C to +165 °C test available

• Burn-in

Shipping

JEDEC trays

Tape and reel services

data sheet

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or

damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard

terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.

www.amkor.com

Cross-section fcCSP

Package Offering (units in mm)

Body Size

Pitch

Ball Count

Matrix

8 x 8

1.0

49

Full

9 x 9

1.0

64

Full

10 x 10

1.0

81

Full

11 x 11

1.0

100

Full

12 x 12

1.0

121

Full

13 x 13

1.0

144

Full

14 x 14

1.0

169

Full

15 x 15

1.0

196

Full

6 x 6

0.8

49

Full

7 x 7

0.8

64

Full

8 x 8

0.8

64

Full

8 x 8

0.8

81

Full

9 x 9

0.8

100

Full

10 x 10

0.8

144

Full

11 x 11

0.8

169

Full

12 x 12

0.8

196

Full

3 x 3

0.5

25

Full

4 x 4

0.5

36

Full

5 x 5

0.5

48

2 Row

5 x 5

0.5

64

Full

6 x 6

0.5

64

2 Row

6 x 6

0.5

84

3 Row

7 x 7

0.5

80

2 Row

7 x 7

0.5

108

3 Row

8 x 8

0.5

96

2 Row

8 x 8

0.5

132

3 Row

9 x 9

0.5

156

3 Row

10 x 10

0.5

180

3 Row

Configuration Options:

fcBGA (Flip Chip BGA):

Moderate routing density, lowest cost flip chip package in intermediate ball

counts. Bare die or Single Piece Lid. Qualified with both BU and 4L thin core

substrates. Ball Count range is 256 - 1900 and Body Size range is 17 - 45 mm.

Ceramic fcBGA (Ceramic Flip Chip BGA):

Alumina or HiTCE flip chip packages with BGA, LGA, or SCI interconnect format.

Capability for high layer count enables most flexible format for different ground

and power planes. Available in bare die, AISiC Lid, or low cost Flat Lid.

Qualified in body sizes ti 45 mm HiTCE (BGA), 45 mm alumina (SCI) and 31

mm alumina (BGA).

Applications:

The fcCSP package is targeted to high-performance workstations, servers, data

communication products, internet routers and at high frequency and RF

packaging applications where electrical performance is critical. The elimination of

wirebond loops allows for a low inductance connection to the die, while the

increased routing density enables optimized electrical paths for critical high

frequency signal lines. The fcCSP is also an attractive option for portable and

handheld electronics where, in addition to performance, package size is critical.

Ceramic fcBGA