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FCCSP 数据表 (PDF) - Amkor Technology
FCCSP Datasheet PDF - Amkor Technology
部件名 FCCSP
下载  FCCSP 下载
文件大小   119.83 Kbytes
页   2 Pages
制造商  AMKOR [Amkor Technology]
网页  http://www.amkor.com
标志 AMKOR - Amkor Technology
功能描述 a flip chip solution in a CSP package format.

FCCSP Datasheet (PDF)

Go To PDF Page 下载 数据表
FCCSP Datasheet PDF - Amkor Technology

部件名 FCCSP
下载  FCCSP Click to download

文件大小   119.83 Kbytes
页   2 Pages
制造商  AMKOR [Amkor Technology]
网页  http://www.amkor.com
标志 AMKOR - Amkor Technology
功能描述 a flip chip solution in a CSP package format.

FCCSP 数据表 (HTML) - Amkor Technology




类似零件编号 - FCCSP

制造商部件名数据表功能描述
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Amkor Technology		 FCCSP AMKOR-FCCSP Datasheet
411Kb / 2P		 Silver Wirebonding
02/22
FCCSP AMKOR-FCCSP_V01 Datasheet
953Kb / 2P		 Amkor Technology offers the Flip Chip CSP (fcCSP) package – a flip chip solution in a CSP package format.
04/20
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类似说明 - FCCSP

制造商部件名数据表功能描述
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Semtech Corporation		 SFC05-4 SEMTECH-SFC05-4 Datasheet
174Kb / 7P		 CSP TVS Flip Chip TVS Diode Array
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California Micro Device...		 CSPRC030 CALMIRCO-CSPRC030 Datasheet
44Kb / 3P		 CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK
CSPRC032 CALMIRCO-CSPRC032 Datasheet
44Kb / 3P		 CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK
logo
Cirrus Logic		 CS98000 CIRRUS-CS98000 Datasheet
420Kb / 46P		 DVD On-a-Chip Solution
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Yamaichi Electronics Co...		 NP284-26409N YAMAICHI-NP284-26409N Datasheet
82Kb / 1P		 Chip Scale Package (CSP, 0.50mm Pitch)
NP383-18010-N YAMAICHI-NP383-18010-N Datasheet
174Kb / 1P		 Chip Scale Package -TH (CSP, 0.50mm Pitch)
logo
Texas Instruments		 SN74F574DWRE4 TI-SN74F574DWRE4 Datasheet
641Kb / 13P		 Eight D-Type Flip-Flops in a Single Package
logo
Formosa MS		 QRDM-CSP01 FORMOSA-QRDM-CSP01 Datasheet
905Kb / 1P		 Flip Chip CSP DIODE
logo
Lumileds Lighting Compa...		 PB116 LUMILEDS-PB116 Datasheet
1Mb / 2P		 High current density Chip Scale Package (CSP) LED
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NXP Semiconductors		 MF0FCP2U1 NXP-MF0FCP2U1 Datasheet
66Kb / 5P		 Flip chip package
Rev. 3.1-8 February 2007
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关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。




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