APPLICATIONS
The fcCSP package is an attractive option for applications in which both performance and form factor are critical. Examples include high-performance mobile devices (including 5G), infotainment and ADAS for automotive and AI. Further, the benefits from low inductance and increased routing density enable optimized electrical paths for highfrequency signals, making fcCSP suitable for Baseband, RF and in-substrate antenna applications.

Features
Suitable for low and high-frequency applications
Low inductance of flip chip bumps – short, direct signal path
No technological limitation to BGA ball count
Target markets – mobile (AP, BB, RF, PMIC), automotive, consumer, connectivity, multi-die (side-by-side or stacked) applications requiring high-routing density
Custom package sizes and shapes with strip-based processing
Coreless, thin core, laminate and molded substrate construction
Bare die, overmolded, exposed die molded constructions
Accommodates package sizes from 1 x 1 mm2 to 25 x 25 mm2
Bump pitches down to 50 μm in-line and 30/60 μm staggered
BGA ball pitches down to 0.3 mm
Package thicknesses down to 0.35 mm
Turnkey solutions – design, bumping, wafer probe, assembly, final test
Exposed die molding available for low-profile and thermal applications
Heat spreader attach available for high-power devices
Bottom side chip attach available for AiP applications (POSSUM™)
Mass reflow and thermal compression chip attach available