FCCSP_V01 pdf, FCCSP_V01 功能描述, FCCSP_V01 数据表, FCCSP

部件名	FCCSP

功能描述	Amkor Technology offers the Flip Chip CSP (fcCSP) package – a flip chip solution in a CSP package format.

文件大小	953.7 Kbytes

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制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

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类似零件编号 - FCCSP_V01

制造商	部件名	数据表	功能描述
Amkor Technology	FCCSP	119Kb / 2P	a flip chip solution in a CSP package format.
Amkor Technology	FCCSP	411Kb / 2P	Silver Wirebonding 02/22

制造商	部件名	数据表	功能描述
Semtech Corporation	SFC05-4	174Kb / 7P	CSP TVS Flip Chip TVS Diode Array
California Micro Device...	CSPRC030	44Kb / 3P	CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK
California Micro Device...	CSPRC032	44Kb / 3P	CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK
Amkor Technology	FCCSP	119Kb / 2P	a flip chip solution in a CSP package format.
Yamaichi Electronics Co...	NP284-26409N	82Kb / 1P	Chip Scale Package (CSP, 0.50mm Pitch)
Yamaichi Electronics Co...	NP383-18010-N	174Kb / 1P	Chip Scale Package -TH (CSP, 0.50mm Pitch)
Formosa MS	QRDM-CSP01	905Kb / 1P	Flip Chip CSP DIODE
Lumileds Lighting Compa...	DS116	1Mb / 17P	High current density Chip Scale Package (CSP) LED
Lumileds Lighting Compa...	PB116	1Mb / 2P	High current density Chip Scale Package (CSP) LED
NXP Semiconductors	MF0FCP2U1	66Kb / 5P	Flip chip package Rev. 3.1-8 February 2007