PBGA

LAMINATE

data sheet

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or

damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard

terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.

www.amkor.com

Process Highlights

Die thickness (max)

13 mils

Bond pad pitch (min)

2.4 mils

Marking

Laser

Ball inspection

Optical

Pack / Ship options

JEDEC trays, Dry pack

Wafer backgrinding

Available

Standard Materials

Package Substrate:

CCL-HL832

Die attach:

Ablestik 2300

Au wire:

Mold compound:

Nitto GE 100L

Solder balls:

63 Sn / 37 Pb

Test Services

Program generation/conversion

Product engineering

Wafer sort

256 Pin x 20 MHz test system available

-55 °C to + 125 °C test available

Tape and Reel services

Burn-in

Shipping

Low profile tray (JEDEC Outline CO-029)

BODY

BALL

BALL

BALL

BALL

PCB THICKNESS

MOLD

TOTAL PACKAGE

SIZE

COUNT

PITCH

MATRIX

DIAM.

2 LYR

4 LYR

CAP

THICKNESS

THK

2 LYR

4LYR

13.0 x 13.0

144

1.0

12 x 12 F

0.51

0.32

0.56

0.80

1.52

1.76

14.0 x 22.0

119

1.27

7 x 17 F

0.76

0.32

0.56

0.90

1.82

2.06

153

1.27

9 x 17 F

0.76

0.32

0.56

0.90

1.82

2.06

15.0 x 15.0

121

1.27

11 x 11 F

0.76

0.32

0.56

1.17

2.09

2.33

156/160

1.00

14 x 14 P

0.51

0.32

0.56

0.80

1.52

1.76

196

1.00

14 x 14 F

0.51

0.32

0.56

0.80

1.52

1.76

17.0 x 17.0 192/208

1.00

16 x 16 P

0.51

0.32

0.56

0.80

1.52

1.76

256

1.00

16 x 16 F

0.51

0.32

0.56

0.80

1.52

1.76

19.0 x 19.0

240

1.00

18 x 18 P

0.51

0.32

0.56

0.80

1.52

1.76

289

1.00

17 x 17 P

0.51

0.32

0.56

0.80

1.52

1.76

324

1.00

18 x 18 P

0.51

0.32

0.56

0.80

1.52

1.76

23.0 x 23.0

169

1.50

13 x 13 F

0.76

0.32

0.56

1.17

2.09

2.33

208/217

1.27

17 x 17 P

0.76

0.32

0.56

1.17

2.09

2.33

240/249

1.27

17 x 17 P

0.76

0.32

0.56

1.17

2.09

2.33

289

1.27

17 x 17 F

0.76

0.32

0.56

1.17

2.09

2.33

288/324

1.00

22 x 22 P

0.63

0.32

0.56

1.17

1.99

2.23

484

1.00

22 x 22 F

0.63

0.32

0.56

1.17

1.99

2.23

27.0 x 27.0

225

1.50

15 x 15 F

0.76

0.32

0.56

1.17

2.09

2.33

256/272

1.27

20 x 20 P

0.76

0.32

0.56

1.17

2.09

2.33

300/316

1.27

20 x 20 P

0.76

0.32

0.56

1.17

2.09

2.33

356

1.27

20 x 20 P

0.76

0.32

0.56

1.17

2.09

2.33

400

1.27

20 x 20 F

0.76

0.32

0.56

1.17

2.09

2.33

416

1.00

26 x 26 P

0.63

0.32

0.56

1.17

1.99

2.23

676

1.00

26 x 26 F

0.63

0.32

0.56

1.17

1.99

2.23

31.0 x 31.0 304/329

1.27

23 x 23 P

0.76

0.52

0.56

1.17

2.29

2.33

360/385

1.27

23 x 23 P

0.76

0.52

0.56

1.17

2.29

2.33

529

1.27

23 x 23 F

0.76

0.52

0.56

1.17

2.29

2.33

516

1.00

30 x 30 P

0.63

0.52

0.56

1.17

2.19

2.23

900

1.00

30 x 30 F

0.63

0.52

0.56

1.17

2.19

2.23

35.0 x 35.0

313

1.27

25 x 25 S

0.76

0.52

0.56

1.17

2.29

2.33

352/388

1.27

26 x 26 P

0.76

0.52

0.56

1.17

2.29

2.33

420/456

1.27

26 x 26 P

0.76

0.52

0.56

1.17

2.29

2.33

452

1.27

26 x 26 P

0.76

0.52

0.56

1.17

2.29

2.33

809

1.27

26 x 26 F

0.76

0.52

0.56

1.17

2.29

2.33

580

1.00

34 x 34 P

0.63

0.52

0.56

1.17

2.19

2.23

680

1.00

34 x 34 P

0.63

0.52

0.56

1.17

2.19

2.23

1,156

1.00

34 x 34 F

0.63

0.52

0.56

1.17

2.19

2.23

37.5 x 37.5

524

1.27

28 x 28 P

0.76

0.52

0.56

1.17

2.29

2.33

784

1.27

28 x 28 F

0.76

0.52

0.56

1.17

2.29

2.33

40.0 x 40.0

564

1.27

30 x 30 P

0.76

0.52

0.56

1.17

2.29

2.33

900

1.27

30 x 30 F

0.76

0.52

0.56

1.17

2.29

2.33

PBGA Standard Package Offering (mm)

P = Perimeter

F = Full Array

S = Stagger

= Maximum possible ball count (may not be

tooled). Additional depopulated options

are available. Contact account manager

for additional tooling.

PBGA Cross Section