data sheet

PBGA

LAMINATE

www.amkor.com

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Innovative designs and expanding package offerings provide

a platform from prototype-to-production.

• Custom ball counts up to 1521

• 1.00, 1.27 & 1.50 mm ball pitch available

• 13 mm to 40 mm body sizes

• Low Profile and lightweight

• Thermal and electrical enhancement capable

• Highly flexible internal routing of signal, power and ground

for device performance and system compatibility

• HDI designs possible

• Suitable substrate for multi-die and integrated SMT structures

• Mature strip based manufacturing process with high yields

• Full in-house design capability

• Quickest design-to-prototype delivery

• Perimeter, stagger and full ball arrays

• Special packaging for memory available

• Multi-layer, ground / power

• JEDEC MS-034 standard outlines

• Excellent reliability

• 63 Sn / 37 Pb Eutectic solder balls

Multi layer PCB, 0 air flow

PCB

Cu

Theta JA

Pkg

Body Size Layer Thickness

(°C/W)

272

27.0 x 27.0

2

N/A

22

388

35.0 x 35.0

2

N/A

19

272

27.0 x 27.0

4

36 µm19

388

35.0 x 35.0

4

36 µm16

356* TE

27.0 x 27.0

4

72 µm16

452* TE

35.0 x 35.0

4

72 µm14

356**TE-2 27.0 x 27.0

4

72 µm

13.5

452**TE-2 35.0 x 35.0

4

72 µm12

*TEPBGA **TEPBGA-2

Results dependent on body size, die size, and PCB design.

Amkor assures you reliable performance by continuously

monitoring key indices:

• Moisture sensitivity

JEDEC Level 3

characterization

30 °C/60% RH/192 hours

• High temp op life

125 °C, 6V, 1000 hours

• Autoclave or unbiased hast 130 °C/85% RH/96 hours

• High temp storage

150 °C, 1000 hours

• Temp cycle

-55/+125 °C, 1000 cycles

Plastic Ball Grid Array

(PBGA):

Amkor’s PBGAs incorporate the most advanced

assembly processes and designs for today’s and

tomorrow’s cost/performance applications. This

advanced IC package technology allows application

and design engineers to optimize innovations

while maximizing the performance characteristics

of semiconductors. Amkor’s PBGAs are designed

for low inductance, improved thermal operation

and enhanced SMT ability. Custom performance

enhancements, like ground and power planes, are

available for significant improvements in electrical

response demanded by advancing electronics.

Additionally, these PBGAs utilize industry proven,

semiconductor grade materials for reliable, long-

term operations while providing the user flexible

design parameters.

Applications:

Semiconductor technologies find enhanced

performance by using the integrated design

features of Amkor’s PBGAs. Microprocessors /

controllers, ASICs, Gate Arrays, memory, DSPs,

PLDs, graphics and PC chip sets find Amkor’s

PBGA family to be an ideal package. Applications

requiring improved portability, form-factor/size

and high-performance such as cellular, wireless

telecommunications, PCMCIA cards, global posi-

tioning systems (GPS), laptop PC's, video cameras,

disc drives, PLDs, graphics and other similar

products benefit from Amkor's PBGA attributes.

DS 520L

Rev Date: 05’07

.

Thermal Resistance:

Reliability:

Features: