5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

VCC

Supply voltage

±18

V

VI

Input voltage (any input)

±15

V

VID

Differential input voltage

±30

V

IO

Output current

±50

mA

TA

Ambient temperature range

–40

125

°C

Tstg

Storage temperature range

–60

125

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

5.2 ESD Ratings

MIN

MAX

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

pins(1)

0

1000

V

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

0

1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC+

Supply voltage

2

16

V

VCC–

–2

–16

VICR

Input common-mode voltage range

–13.5

13.5

V

TA

Operating free-air temperature

–40

125

°C

5.4 Thermal Information

THERMAL METRIC(1)

RC4580

UNIT

D

(SOIC)

P

(PDIP)

PW

(TSSOP)

DGK

(VSSOP)

DDF

(SOT-23)

8 PINS

8 PINS

8 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

109

99.2

163

160.5

177.9

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

55.7

78.8

38

70.2

96.5

RθJB

Junction-to-board thermal resistance

49

61.9

90.6

95.6

95.2

ψJT

Junction-to-top characterization parameter

10.6

44.8

1.3

8.8

9.5

ψJB

Junction-to-board characterization parameter

48.6

61.2

88.9

94.0

95.0

RθJC(bot) Junction-to-case (bottom) thermal resistance

—

—

—

—

—

(1)

For more information about traditional and new thermal metrics, see the Semiconductor IC Package Thermal Metrics application note.

RC4580

SLOS412E – APRIL 2003 – REVISED NOVEMBER 2024

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