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AD8310

Rev. F | Page 22 of 24

DIE INFORMATION

BOND PAD STATISTICS

ALL MEASUREMENTS IN MICRONS

MINIMUM PASSIVATION OPENING: 92 × 92, MINIMUM PAD PITCH: 150

DIE SIZE CALCULATION

ALL MEASUREMENTS IN MICRONS

DIE X (WIDTH OF DIE IN X DIRECTION) = 745

DIE Y (WIDTH OF DIE IN Y DIRECTION) = 1390

DIE THICKNESS = 305

COORDINATES OF BOND PAD CENTERS:

(1) –233, +540 (2) –250, +310

(3) –250, –273

(4) –250, –519 (5B) +250, –366 (5A) +250, –516

(6) +250, –218 (7) +249, +310

(8) +233, +540

Figure 43. Die Outline Dimensions

Table 7. Die Pad Function Descriptions

Pin No.

Mnemonic

Description

INLO

One of Two Balanced Inputs. Biased roughly to VPOS/2.

COMM

Common Pin. Usually grounded.

OFLT

Offset Filter Access. Nominally at about 1.75 V.

VOUT

Low Impedance Output Voltage. Carries a 25 mA maximum load.

5A, 5B

VPOS

Positive Supply. 2.7 V to 5.5 V at 8 mA quiescent current.

BFIN

Buffer Input. Used to lower postdetection bandwidth.

ENBL

CMOS Compatible Chip Enable. Active when high.

INHI

Second of Two Balanced Inputs. Biased roughly to VPOS/2.

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