MC44BC373C/374C Technical Data

Application and Case Diagrams

16.2 Packaging Instructions

Tape and reel packaging per 12MRH00360A with the following conditions applicable for Dual In-Line

SOP (SOIC) package.

16.3 Marking Instructions

SO16NB Package:

TSSOP16 package

Component Orientation: Arrange parts with the pin 1

side closest to the tape's round sprocket holes on the

tape's trailing edge.

44BC37xCD

Bar marked part way accross Pin 1 end of package.

Bar width 10 to 20 mils, length to be at least four

times Bar width. Bar placement may extend across

chamfer and dimple areas.

Pin 1 Dot or Dimple

•1st line:

44BC373CD for MC44BC373CD device

44BC374CD for MC44BC374CD device

(Part number coded on 10 digits)

•

2nd line:

Assembly site code AW (2 digits) followed by the

wafer lot code L (1 digit),

year Y (1 digit) and

work week WW (2 digits)

•

1st line: 44BC

(Part number coded on 4 digits)

•2nd line: 373C for MC44BC373CDTB device

374C for MC44BC374CDTB device

(Part number coded on 4 digits)

•

3rd line: Assembly site code A (1 digit) followed by the

wafer lot code L (1 digit),

year Y (1 digit) and

work week W (1 digit)

37xC

44BC

Freescale Semiconductor, Inc.

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