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DA9081.006

1 August, 2005

MAS9081 PAD LAYOUT

VDD

QO2

QO1

QI

AGC

RFI2

RFIM

PDN1

AON

PDN2

OUT

DEC

9081Ax,

x=1, 3, 4 or 5

VSS

1494 µ

µ

µ

µ

m

RFIP

DIE size = 1.49 x 1.69 mm; PAD size = 80 x 80 µm

Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or

left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component

assembly are recommended to be performed in ESD protected area.

Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die.

Pad Identification

Name

X-coordinate

Y-coordinate

Note

Power Supply Voltage

VDD

174 µm

1452 µm

Quartz Filter Output for Crystal 2

QO2

174 µm

1247 µm

Quartz Filter Output for Crystal 1

QO1

174 µm

1043 µm

Quartz Filter Input for Crystals

QI

174 µm

839 µm

AGC Capacitor

AGC

174 µm

633 µm

Power Down/Frequency Selection Input 2

PDN2

174 µm

430 µm

3

Receiver Output

OUT

175 µm

224 µm

1

Demodulator Capacitor

DEC

1318 µm

240 µm

AGC On Control

AON

1318 µm

444 µm

2

Power Down/Frequency Selection Input 1

PDN1

1318 µm

648 µm

3

Positive Receiver Input

RFIP

1318 µm

853 µm

4

Negative Receiver Input

RFIM

1318 µm

1057 µm

4

Receiver Input 2 (for Antenna Capacitor 2)

RFI2

1318 µm

1262 µm

Power Supply Ground

VSS

1318 µm

1466 µm

Notes:

1) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced

(modulated)

-

-

at power down the output is pulled to VSS (pull down switch)

2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working)

-

Internal pull-up with current < 1 µA which is switched off at power down

3) PDN1 = VDD and PDN2 = VDD means receiver off

-

Fast start-up is triggered when the receiver is after power down controlled to power up

4) Receiver inputs RFIP and RFIM have both 600 kΩ biasing resistances against ground