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TDA4AEN...Q1 数据表(PDF) 221 Page - Texas Instruments |
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TDA4AEN...Q1 数据表(HTML) 221 Page - Texas Instruments |
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221 / 236 page ![]() For this example, the designer must understand which variables effect the maximum trigger threshold when selecting resistor values. A device which has a VMON_VSYS input threshold of 0.45V + 3% needs to be considered when trying to design a voltage divider that doesn’t trip until the system supply drops 10%. The effect of resistor tolerance and input leakage also needs to be considered, but the contribution to the maximum trigger point is not obvious. When selecting component values which produce a maximum trigger voltage, the system designer must consider a condition where the value of R1 is 1% low and the value of R2 is 1% high combined with a condition where input leakage current for the VMON_VSYS pin is 2.5µA. When implementing a resistor divider where R1 = 4.81KΩ and R2 = 40.2KΩ, the result is a maximum trigger threshold of 4.517V. Once component values have been selected to satisfy the maximum trigger voltage as described above, the system designer can determine the minimum trigger voltage by calculating the applied voltage that produces an output voltage of 0.45V - 3% when the value of R1 is 1% high and the value of R2 is 1% low, and the input leakage current is 10nA, or zero. Using an input leakage of zero with the resistor values given above, the result is a minimum trigger threshold of 4.013V. This example demonstrates a system power supply voltage trip point that ranges from 4.013V to 4.517V. Approximately 250mV of this range is introduced by VMON_VSYS input threshold accuracy of ±3%, approximately 150 mV of this range is introduced by resistor tolerance of ±1%, and approximately 100mV of this range is introduced by loading error when VMON_VSYS input leakage current is 2.5µA. The resistor values selected in this example produces approximately 100µA of bias current through the resistor divider when the system supply is 4.5V. The 100mV of loading error mentioned above can be reduced to about 10mV by increasing the bias current through the resistor divider to approximately 1mA. So resistor divider bias current vs loading error is something the system designer needs to consider when selecting component values. The system designer must also consider implementing a noise filter on the voltage divider output since VMON_VSYS has minimum hysteresis and a high-bandwidth response to transients. This can be done by installing a capacitor across R1 as shown in Figure 8-5. However, the system designer must determine the response time of this filter based on system supply noise and expected response to transient events. Device VMON_VSYS SPRSP56_VMON_ER_MON_01 VSS 4.81 k 1% Ω ± 40.2 k 1% Ω ± VSYS R1 R2 C1 Value = Determined by system designer (System Power Supply) Figure 8-5. System Supply Monitor Voltage Divider Circuit VMON_1P8_SOC pin provides a way to monitor external 1.8V power supplies. This pin must be connected directly to their respective power source. An internal resistor divider with software control is implemented inside the SoC for each of these pins. Software can program each internal resistor divider to create appropriate under voltage and over voltage interrupts. VMON_3P3_SOC pin provides a way to monitor external 3.3V power supplies. This pin must be connected directly to their respective power source. An internal resistor divider with software control is implemented inside the SoC for each of these pins. Software can program each internal resistor divider to create appropriate under voltage and over voltage interrupts. www.ti.com TDA4VEN-Q1, TDA4AEN-Q1 SPRSP96A – MARCH 2024 – REVISED SEPTEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 221 Product Folder Links: TDA4VEN-Q1 TDA4AEN-Q1 |
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