June 19, 2007 S71GL-N_00_02

S71GL-N Based MCPs

9

Da ta

Sh e e t

(Adv a n ce

In f o r m ation)

6.

Physical Dimensions

6.1

TLC056—56-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 7 mm Package

3348 \ 16-038.22a

PACKAGE

TLC 056

JEDEC

N/A

D x E

9.00 mm x 7.00 mm

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

A

---

---

1.20

PROFILE

A1

0.20

---

---

BALL HEIGHT

A2

0.81

---

0.97

BODY THICKNESS

D

9.00 BSC.

BODY SIZE

E

7.00 BSC.

BODY SIZE

D1

5.60 BSC.

MATRIX FOOTPRINT

E1

5.60 BSC.

MATRIX FOOTPRINT

MD

8

MATRIX SIZE D DIRECTION

ME

8

MATRIX SIZE E DIRECTION

n

56

BALL COUNT

φb

0.35

0.40

0.45

BALL DIAMETER

eE

0.80 BSC.

BALL PITCH

eD

0.80 BSC

BALL PITCH

SD / SE

0.40 BSC.

SOLDER BALL PLACEMENT

A1,A8,D4,D5,E4,E5,H1,H8

DEPOPULATED SOLDER BALLS

NOTES:

1.

DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

2.

ALL DIMENSIONS ARE IN MILLIMETERS.

3.

BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.

4.

e REPRESENTS THE SOLDER BALL GRID PITCH.

5.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"

DIRECTION.

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS

FOR MATRIX SIZE MD X ME.

6

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

7

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A

AND B AND DEFINE THE POSITION OF THE CENTER SOLDER

BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE

OUTER ROW SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE

OUTER ROW, SD OR SE = e/2

8.

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED

BALLS.

9.

N/A

10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

E1

7

SE

A

D1

eD

DC

E

F

G

H

8

7

6

4

3

2

1

eE

5

B

PIN A1

CORNER

7

SD

BOTTOM VIEW

C

0.08

0.20 C

A

E

B

C

0.15

(2X)

C

D

C

0.15

(2X)

INDEX MARK

10

6

b

TOP VIEW

SIDE VIEW

CORNER

56X

A1

A2

A

0.15 M

M

C

C

AB

0.08

PIN A1