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STR750FV0 数据表(PDF) 76 Page - STMicroelectronics |
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STR750FV0 数据表(HTML) 76 Page - STMicroelectronics |
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76 / 84 page ![]() Package characteristics STR750Fxx STR751Fxx STR752Fxx STR755Fxx 76/84 6 Package characteristics In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com. 6.1 Package mechanical data Figure 45. 64-pin low profile quad flat package (10x10) Dim. mm inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 1.60 0.0630 A1 0.05 0.15 0.0020 0.0059 A2 1.35 1.40 1.45 0.0531 0.0551 0.0571 b 0.17 0.22 0.27 0.0067 0.0087 0.0106 C 0.09 0.20 0.0035 0.0079 D 12.00 0.4724 D1 10.00 0.3937 E 12.00 0.4724 E1 10.00 0.3937 e 0.50 0.0197 K 0° 3.5° 7° 0° 3.5° 7° L 0.45 0.60 0.75 0.0177 0.0236 0.0295 L1 1.00 0.0394 Number of pins N 64 L1 L K 0.10mm .004 seating plane A A2 A1 B e c D D1 D3 E E1 E3 PIN 1 IDENTIFICATION M x 45° |
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