AD8372

Rev. 0 | Page 13 of 16

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30

0.23

0.18

0.20 REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

12° MAX

1.00

0.85

0.80

SEATING

PLANE

COPLANARITY

0.08

1

32

8

9

25

24

16

17

0.50

0.40

0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25

3.10 SQ

2.95

PIN 1

INDICATOR

0.60 MAX

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

Figure 17. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature

Range

Package Description

Package

Option

Ordering

Quantity

AD8372ACPZ-WP1

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Waffle Pack

CP-32-2

AD8372ACPZ-R71

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 7” Reel

CP-32-2

1,500

AD8372-EVALZ1

Evaluation Board