Data Sheet Rev. B, September 2019 | Subject to change without notice

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ACT4530M

40 V/3.0 A CV/CC Buck Converter Featuring QC2.0, USB Auto-Detect and USB-PD

APPLICATIONS INFORMATION

PCB Layout Guidance

When laying out the printed circuit board, the following

checklist should be used to ensure proper operation of

the IC.

1.

Arrange the power components to reduce the AC

loop size consisting of CIN, VIN pin, SW pin and the

Schottky diode.

2.

The high power loss components, e.g. the controller,

Schottky diode, and the inductor should be placed

carefully to make the thermal spread evenly on

the board.

3.

Place input decoupling ceramic capacitor CIN as

close as possible to the VIN pin and power pad. CIN

must be connected to power GND with a short and

wide copper trace.

4.

Schottky anode pad and IC exposed pad should be

placed close to ground clips in CLA applications.

5.

Use “Kelvin” or “4-wire” connection techniques from

the sense resistor pads directly to the CSP and

CSN pins. The CSP and CSN traces should be in

parallel to avoid interference.

6.

Place multiple vias between top and bottom GND

planes for best heat dissipation and noise immunity.

7.

Use short traces connecting HSB-CHSB-SW loop.

8.

SW pad is noise node switching from VIN to GND. It

should be isolated away from the rest of circuit for

good EMI and low noise operation.

Example PCB Layout