Data Sheet

ADRF5030

APPLICATIONS INFORMATION

analog.com

Rev. 0 | 12 of 13

The ADRF5030 has two power-supply pins (VDD and VSS) and two

control pins (EN, CTRL). Figure 16 shows the external components

and connections for the supply pin. The VDD and VSS pins are

decoupled with a 100 pF capacitor. The device pinout allows the

placement of the decoupling capacitors close to the device. No

other external components are needed for bias and operation,

except DC-blocking capacitors on the RF pins when the RF lines

are biased at a voltage other than 0 V. See Table 6 for details.

Figure 16. Recommended Schematic

RECOMMENDATIONS FOR PRINTED CIRCUIT

BOARD DESIGN

The RF ports are matched to 50 Ω internally and the pinout is

designed to mate a coplanar waveguide (CPWG) with 50 Ω charac-

teristic impedance on the PCB. Figure 17 shows the referenced

CPWG RF trace design for an RF substrate with 8 mil thick Rogers

RO4003C dielectric material. RF trace with 14 mil width and 7 mil

clearance is recommended for 1.5 mil finished copper thickness.

Figure 17. Example PCB Stack-up

Figure 18 shows the routing of the RF traces, supply, and control

signals from the device. The ground planes are connected with

densely filled vias for optimal RF and thermal performance. The

primary thermal path for the device is the bottom side.

Figure 18. PCB Layout

Figure 19 shows the recommended layout from the device RF

pins to the 50 Ω CPWG on the referenced stack-up. PCB pads

are drawn 1:1 to device pads. The ground pads are drawn solder

mask defined and the signal pads are drawn as pad defined. The

RF trace from the PCB pad is extended with the same width to

the package edge and tapered to RF trace. The paste mask is

designed to match the device pads without any aperture reduction.

The paste mask is divided into multiple openings for the paddle.

Figure 19. Recommended RF Pin Transition

For alternate PCB stack-ups with different dielectric thickness and

RF trace design, contact Analog Devices Technical Support for

further recommendations.