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ADL6337ACRZB-R7 数据表(PDF) 8 Page - Analog Devices

部件名 ADL6337ACRZB-R7
功能描述  35 dB Gain, 500 MHz to 5200 MHz Transmit VGA
PDF  53 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADL6337ACRZB-R7 数据表(HTML) 8 Page - Analog Devices

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Data Sheet
ADL6337
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
analog.com
Rev. E | 8 of 53
Figure 6. Pin Configuration
Table 6. Pin Function Descriptions
Pin No.
Mnemonic
Type
Description
1
TXENP
Input
Amplifier Enable.
2, 7, 8, 15, 16, 17, 28
NIC
No Internal Connection. These pins have no physical connection within the chip. They can be
grounded or floated.
3, 6, 12, 13, 18, 19, 20,
22, 23
GND
Input/Output
Ground.
4
RFIN_P
Input
Positive RF Input.
5
RFIN_N
Input
Negative RF Input.
9
ATTSEL1
Input
Fast Attenuation Selection.
10
ATTSEL2
Input
Fast Attenuation Selection.
11
V50AMP1
Input
Amplifier 1 Analog Power Supply (5.0 V).
14
V50AMP2
Input
Amplifier 2 Analog Power Supply (5.0 V).
21
RFOUT
Output
Single-Ended RF Output.
24
SDO
Output
Serial Port Data Output in 4-Wire SPI Mode. Analog Devices, Inc., recommends to leave this pin
floating when 3-wire SPI mode is used.
25
CS
Input
Serial Port Latch Enable Input.
26
SDIO
Input/Output
Serial Port Bidirectional Data Input/Output.
27
SCLK
Input
Serial Port Clock Input.
29
CS_A2
Input
Chip Select. Refer to the Configuring Multiple Chips to Share the SPI Bus section for information
about the connections in a multiple chip operation. Ground these pins if unused.
30
CS_A1
Input
Chip Select. Refer to the Configuring Multiple Chips to Share the SPI Bus section for information
about the connections in a multiple chip operation. Ground these pins if unused.
31
CS_A0
Input
Chip Select. Refer to the Configuring Multiple Chips to Share the SPI Bus section for information
about the connections in a multiple chip operation. Ground these pins if unused.
32
V50BIAS
Input
Bias Circuitry Power Supply (5.0 V)
EPAD
Input/Output
Exposed Pad 1. The exposed pad must be connected to ground for electrical and thermal
purposes.



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