TLV2354, TLV2354Y

LinCMOS

™ QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS

SLCS012C – MAY 1992 – REVISED AUGUST 2000

4

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TLV2354Y chip information

This chip, when properly assembled, displays characteristics similar to the TLV2354. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with

conductive epoxy or a gold-silicon preform.

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (11) INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

OUT

IN +

IN –

VDD

GND

(10)

(7)

(6)

(11)

(1)

–

+

(13)

IN +

IN –

OUT

(12)

(4)

(5)

–

+

(2)

+

–

(9)

(8)

(14)

OUT

IN +

IN –

OUT

IN +

IN –

(3)

BONDING PAD ASSIGNMENTS

65

90

(13)

(1)

(3)

(4)

(5)

(6)

(7)

(8)

(9)

(10)

(11)

(12)

(14)

(2)