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TLV2354MFKB 数据表(PDF) 1 Page - Texas Instruments

部件名 TLV2354MFKB
功能描述  LinCMOSE QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS
PDF  20 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

TLV2354MFKB 数据表(HTML) 1 Page - Texas Instruments

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TLV2354, TLV2354Y
LinCMOS
™ QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS
SLCS012C – MAY 1992 – REVISED AUGUST 2000
1
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
D Wide Range of Supply Voltages
2 V to 8 V
D Fully Characterized at 3 V and 5 V
D Very-Low Supply-Current Drain
240
µA Typ at 3 V
D Common-Mode Input Voltage Range
Includes Ground
D High Input Impedance ...1012 Ω Typ
D Fast Response Time . . . 200 ns Typ for
TTL-Level Input Step
D Extremely Low Input Bias Current
5 pA Typ
D Output Compatible With TTL, MOS, and
CMOS
D Built-In ESD Protection
description
The TLV2354 consists of four independent,
low-power comparators specifically designed for
single power-supply applications and operateS
with power-supply rails as low as 2 V. When
powered from a 3-V supply, the typical supply
current is only 240
µA.
The TLV2354 is designed using the Texas Instruments LinCMOS
™ technology and, therefore, features an
extremely high input impedance (typically greater than 1012
Ω), which allows direct interfacing with
high-impedance sources. The outputs are N-channel open-drain configurations that require an external pullup
resistor to provide a positive output voltage swing, and they can be connected to achieve positive-logic
wired-AND relationships. The TLV2354I is fully characterized for operation from – 40
°C to 85°C. The TLV2354M
is fully characterized for operation from – 55
°C to 125°C.
The TLV2354 has internal electrostatic-discharge (ESD)-protection circuits and has been classified with a
1000-V ESD rating using human body model testing. However, care should be exercised in handling this device
as exposure to ESD may result in degradation of the device parametric performance.
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
VIOmax
at 25
°C
SMALL
OUTLINE
(D)†
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
(PW)‡
CERAMIC
FLATPACK
(W)
CHIP
FORM
(Y)
–40
°C to
85
°C
5 mV
TLV2354ID
TLV2354IN
TLV2354IPW
TLV2354Y
–55
°C to
125
°C
5 mV
TLV2354MFK
TLV2354MJ
TLV2354MW
TLV2354Y
† The D package is available taped and reeled. Add the suffix R to the device type (e.g., TLV2352IDR).
‡ The PW packages are only available left-ended taped and reeled (e.g., TLV2354IPW).
These devices have limited built-in protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
© 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
LINCMOS is a trademark of Texas Instruments.
OUT
symbol (each comparator)
IN +
IN –
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.


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