PU3JBH

Taiwan Semiconductor

2

Version: A2409

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-lead thermal resistance

RӨJL

14

°C/W

Junction-to-ambient thermal resistance

RӨJA

68

°C/W

Junction-to-case thermal resistance

RӨJC

16

°C/W

Thermal Performance Note: Units mounted on PCB (10mm x 10mm Cu pad test board)

ELECTRICAL SPECIFICATIONS (T

A

= 25°C unless otherwise noted)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX UNIT

Forward voltage(1)

IF = 1.5A, TJ = 25°C

VF

1.18

-

V

IF = 3.0A, TJ = 25°C

1.30

1.5

V

IF = 1.5A, TJ = 125°C

0.93

-

V

IF = 3.0A, TJ = 125°C

1.08

-

V

Reverse current @ rated VR(2)

TJ = 25°C

IR

-

2

µA

TJ = 125°C

2

-

µA

Junction capacitance

1MHz, VR = 4.0V

CJ

17

-

pF

Reverse recovery time

IF = 0.5A, IR = 1.0A, Irr = 0.25A

trr

-

25

ns

IF = 1.0A, di/dt = 50A/µs, VR = 30V

29

-

Reverse recovery current

IF = 3.0A, di/dt = 200A/µs, VR = 400V

IRM

2.2

-

A

Reverse recovery charge

Qrr

81

-

nC

Reverse recovery time

trr

49

-

ns

Notes:

1.

Pulse test with PW = 0.3ms

2.

Pulse test with PW = 30ms

ORDERING INFORMATION

ORDERING CODE

PACKAGE

PACKING

PU3JBH

DO-214AA (SMB)

3,000/ Tape & Reel