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Version 3.3 – November 2024

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4.3.3 Address selection pin (ADDR)

A resistor between ADDR and VDD may be used to configure the I2C address the STC31-C uses for

communication. The selectable addresses and their respective conditions are:

I2C Address (hex)

Condition

0x29 (default)

Ground or no connection between ADDR (pin 3) and VDD (pin 6)

0x2A

10 kOhm (±5%) between ADDR (pin 3) and VDD (pin 6)

0x2B

3.3 kOhm (±5%) between ADDR (pin 3) and VDD (pin 6)

0x2C

1 kOhm (±5%) between ADDR (pin 3) and VDD (pin 6)

4.3.4 Die pad (center pad)

The die pad or center pad is visible from below and located in the center of the package. It is electrically floating

and therefore it is recommended to connect it to GND. Depending on the application, it may or may not be

advantageous to solder the center pad to a larger ground trace/plane to increase thermal coupling.

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Shipping package

STC31-C is provided in tape & reel shipment packaging. Available packaging size is 400 or 5000 units per

reel.

Figure 4 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to the right

and trailer tape to the left on this drawing. Dimensions are given in millimeters.

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Ordering information

Use the part names and product numbers shown in the following table when ordering STC31-C Thermal

Conductivity Sensor. For the latest product information and local distributors, visit www.sensirion.com.

Part name

Description / Output

Order number

Packaging

Tape & reel size

SEK-STC31-C

I2C

3.001.061

Single package evaluation kit

n/a

STC31-C-R3

3.001.031

Tape & Reel

400

STC31-C-R5

3.001.032

Tape & Reel

5000