General Note

TT Electronics reserves the right to make changes in product specification without

notice or liability. All information is subject to TT Electronics’ own data and is

considered accurate at time of going to print.

TT Electronics | OPTEK Technology

2900 E. Plano Parkway, St 200, Plano, TX 75074, USA | Ph: +1 972 323 2200

www.ttelectronics.com | sensors@ttelectronics.com

Rev C, 4/27/2023

Page 38

© TT electronics plc

FlexSense® I-Series Programmable

Incremental Encoder

FS210/FS310 Datasheet

Recommended Reflow Profile

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

8 minutes max.

150 °C

200 °C

60-120 seconds

217 °C

Tp

TL

Time

260 °C

Tc =specifiedclassificationtemperature

The peak temperature must not exceed 260 °C.

The time above 255 °C must not exceed 30 seconds.

Liquidous

temperature

60-150 seconds

Figure 18. Recommended reflow profile at MSL-4 rating.

Shelf Life

All parts are shipped in Moisture Barrier Bags with desiccant to protect them against ambient moisture in the environment.

The parts can be stored in their original, unopened bags for 12 months at < 40°C, < 90% RH, after which, their shelf life will

have been exceeded.

Floor Life

The FS210 and FS310 parts have been qualified for Moisture Sensitivity Level 4. Once the Moisture Barrier Bags have been

opened in an ≤ 30°C/60% RH manufacturing environment, the parts must be soldered within 72 hours, after which, their

floor life will have been exceeded.

Rebaking Instructions

All parts that exceed the shelf life or floor life must be rebaked using one of the following options:

•

125°C for 4 hours, < 5% RH

•

85°C for 18 hours, < 5% RH