OUT-

OUT+

EN

IN-

IN+

GND

IN-

IN+

N/C

EN

OUT-

OUT+

VCC

1

2

3

4

8

6

5

7

GND

DAP

GND

IN-

IN+

N/C

EN

OUT-

OUT+

VCC

1

2

3

4

8

6

5

7

DS92001

www.ti.com

SNLS147F – JUNE 2002 – REVISED APRIL 2013

DS92001 3.3V B/LVDS-BLVDS Buffer

Check for Samples: DS92001

1

FEATURES

DESCRIPTION

The DS92001 B/LVDS-BLVDS Buffer takes a BLVDS

2

•

Single +3.3 V Supply

input signal and provides a BLVDS output signal. In

•

Receiver Inputs Accept LVDS/CML/LVPECL

many large systems, signals are distributed across

Signals

backplanes. One of the limiting factors for system

•

TRI-STATE Outputs

speed is the "stub length" or the distance between

the transmission line and the unterminated receivers

•

Receiver Input Threshold < ±100 mV

on

individual

cards.

Although

it

is

generally

•

Fast Propagation Delay of 1.4 ns (typ)

recognized that this distance should be as short as

•

Low Jitter 400 Mbps Fully Differential Data

possible to maximize system performance, real-world

Path

packaging concerns often make it difficult to make the

stubs as short as the designer would like.

•

Compatible with BLVDS 10-bit SerDes (40MHz)

The DS92001 has edge transitions optimized for

•

Compatible with ANSI/TIA/EIA-644-A LVDS

multidrop backplanes where the switching frequency

Standard

is in the 200 MHz range or less. The output edge rate

•

Available in SOIC and Space Saving WSON

is critical in some systems where long stubs may be

Package

present, and utilizing a slow transition allows for

•

Industrial Temperature Range

longer stub lengths.

The DS92001, available in the WSON package, will

allow the receiver inputs to be placed very close to

the main transmission line, thus improving system

performance.

A wide input dynamic range allows the DS92001 to

receive differential signals from LVPECL, CML as

well as LVDS sources. This will allow the device to

also fill the role of an LVPECL-BLVDS or CML-

BLVDS translator.

Connection and Block Diagrams

Figure 1. SOIC Package Number D0008A

Figure 2. WSON Package Number NGK0008A

Top View

Top View

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Copyright © 2002–2013, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.