PCF8563

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© NXP Semiconductors N.V. 2015. All rights reserved.

Product data sheet

Rev. 11 — 26 October 2015

5 of 45

NXP Semiconductors

PCF8563

Real-time clock/calendar

7.2 Pin description

[1]

The die paddle (exposed pad) is connected to VSS through high ohmic (non-conductive) silicon attach and

should be electrically isolated. It is good engineering practice to solder the exposed pad to an electrically

isolated PCB copper pad for better heat transfer but it is not required as the RTC doesn’t consume much

power. In no case should traces be run under the package exposed pad.

Table 3.

Pin description

Symbol

Pin

Description

SO8, TSSOP8

HVSON10

OSCI

1

1

oscillator input

OSCO

2

2

oscillator output

INT

3

4

interrupt output (open-drain; active LOW)

VSS

45[1]

ground

SDA

5

6

serial data input and output

SCL

6

7

serial clock input

CLKOUT

7

8

clock output, open-drain

VDD

8

9

supply voltage

n.c.

-

3, 10

not connected; do not connect and do not

use as feed through