PCM2906C

SBFS037

– NOVEMBER 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGING/ORDERING INFORMATION(1)

SPECIFIED

TRANSPORT

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

MEDIA,

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

NUMBER

QUANTITY

PCM2906CDB

Rails, 47

PCM2906CDB

SSOP-28

DB

–25°C to +85°C

PCM2906C

Tape and Reel,

PCM2906CDBR

2000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

PARAMETER

PCM2906C

UNIT

Supply voltage, VBUS

–0.3 to 6.5

V

Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU

±0.1

V

SEL0, SEL1, DIN

–0.3 to 6.5

Digital input voltage

V

D+, D

–, HID0, HID1, HID2, XTI, XTO, DOUT, SSPND

–0.3 to (VDDI + 0.3) < 4

VINL, VINR, VCOM, VOUTR, VOUTL

–0.3 to (VCCCI + 0.3) < 4

Analog input voltage

V

VCCCI, VCCP1I, VCCP2I, VCCXI, VDDI

–0.3 to 4

Input current (any pins except supplies)

±10

mA

Ambient temperature under bias

–40 to +125

°C

Storage temperature, Tstg

–55 to +150

°C

Junction temperature, TJ

+150

°C

Lead temperature (soldering, 5s)

+260

°C

Package temperature (IR reflow, peak)

+250

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

PCM2906C

THERMAL METRIC(1)

DB (SSOP)

UNITS

28 PINS

θJA

Junction-to-ambient thermal resistance

64.5

θJCtop

Junction-to-case (top) thermal resistance

24.5

θJB

Junction-to-board thermal resistance

25.4

°C/W

ψJT

Junction-to-top characterization parameter

2.0

ψJB

Junction-to-board characterization parameter

25.0

θJCbot

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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© 2011, Texas Instruments Incorporated

Product Folder Link(s): PCM2906C