2006-07-03

10

LG V196, LO V196, LS V196, LY V196

Empfohlenes Lötpaddesign

8)

Seite 14

IR Reflow Löten

Recommended Solder Pad

8)

page 14

IR Reflow Soldering

Lötbedingungen

Vorbehandlung nach JEDEC Level 2

Soldering Conditions

Preconditioning acc. to JEDEC Level 2

IR-Reflow Lötprofil für bleifreies Löten

(nach J-STD-020B)

IR Reflow Soldering Profile for lead free soldering

(acc. to J-STD-020B)

OHPY1303

on pad

Component location

2.8

11

OHLA0687

0

0

T

t

˚C

s

120 s max

50

100

150

200

250

300

Ramp Up

100 s max

50

100

150

200

250

300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

+5 ˚C

Minimum Solder Profile

10 s min