STM32F427NET7 datasheet(229/231 Pages) STMICROELECTRONICS

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STM32F427xx STM32F429xx

Revision history

230

19-Feb-2015

Update SPI/IS2 in Table 2: STM32F427xx and STM32F429xx features

and peripheral counts.

Updated LQFP208 in Table 4: Regulator ON/OFF and internal reset

ON/OFF availability.

Updated Figure 19: Memory map.

Changed PLS[2:0]=101 (falling edge) maximum value in Table 22:

reset and power control block characteristics.

Updated current consumption with all peripherals disabled in Table 24:

Typical and maximum current consumption in Run mode, code with

data processing running from Flash memory (ART accelerator

enabled except prefetch) or RAM. Updated note 1. in Table 28: Typical

and maximum current consumptions in Standby mode.

Updated tWUSTOP in Table 36: Low-power mode wakeup timings.

Updated ESD standards and Table 53: ESD absolute maximum

ratings.

Updated Table 56: I/O static characteristics.

Section : I2C interface characteristics: updated section introduction,

removed Table I2C characteristics, Figure I2C bus AC waveforms and

measurement circuit and Table SCL frequency; added Table 61: I2C

analog filter characteristics.

Updated measurement conditions in Table 62: SPI dynamic

characteristics.

Updated Figure 51: Typical connection diagram using the ADC.

Updated Section : Device marking for LQFP100.

Updated Figure 83: WLCSP143 - 143-pin, 4.521x 5.547 mm, 0.4 mm

pitch wafer level chip scale package outline and Table 111: WLCSP143

- 143-pin, 4.521x 5.547 mm, 0.4 mm pitch wafer level chip scale

package mechanical data; added Figure 84: WLCSP143 - 143-pin,

4.521x 5.547 mm, 0.4 mm pitch wafer level chip scale recommended

footprint and Table 112: WLCSP143 recommended PCB design rules

(0.4 mm pitch). Updated Figure 85: WLCSP143 marking example

(package top view) and related note. Updated Section : Device

marking for WLCSP143.

Updated Section : Device marking for LQFP144.

Updated Section : Device marking for LQFP176.

Updated Figure 92: LQFP208 - 208-pin, 28 x 28 mm low-profile quad

flat package outline; Updated Section : Device marking for LQFP208.

Modified UFBGA169 pitch, updated Figure 95: UFBGA169 - 169-ball 7

x 7 mm 0.50 mm pitch, ultra fine pitch ball grid array package outline

and Table 116: UFBGA169 - 169-ball 7 x 7 mm 0.50 mm pitch, ultra

fine pitch ball grid array package mechanical data; updated Section :

Device marking for LQFP208.

updated Section : Device marking for UFBGA169, Section : Device

marking for UFBGA176+25 and Section : Device marking for

TFBGA176.

Updated Z pin count in Table 122: Ordering information scheme.

Table 124. Document revision history

Date

Revision

Changes

STM32F427NET7 数据表(PDF) 229 Page - STMicroelectronics

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