TLC27L4, TLC27L4A, TLC27L4B, TLC27L4Y, TLC27L9

LinCMOS

™ PRECISION QUAD OPERATIONAL AMPLIFIERS

SLOS053C – OCTOBER 1987 – REVISED AUGUST 1994

4

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TLC27L4Y chip information

These chips, when properly assembled, display characteristics similar to the TLC27L4C. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (11) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

1OUT

1IN +

1IN –

VDD

(4)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN +

2IN –

2OUT

(11)

GND

+

–

3OUT

3IN +

3IN –

(13)

(10)

(9)

(12)

(8)

–

+

(14)

4OUT

4IN +

4IN –

68

108

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(9)

(10)

(11)

(12)

(13)

(14)