SY75608 datasheet(36/44 Pages) MICROCHIP

36 / 44 page

SY75608/612

DS20006363D-page 36

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2021 - 2023 Microchip Technology Inc. and its subsidiaries

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

0.50 BSC

0.80

0.00

0.90

0.02

MILLIMETERS

MIN

NOM

1.00

0.05

MAX

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

0.20 REF

0.35

0.18

0.25

0.40

0.45

0.30

1.53 REF

4.05

8.00 BSC

4.15

4.25

4.05

8.00 BSC

4.15

4.25

DETAIL 1

ALTERNATE TERMINAL

CONFIGURATIONS

56-Lead Very Thin Plastic Quad Flat, No Lead Package (K3C) - 8x8x1.0 mm Body [VQFN]

With 4.15 mm Exposed Pad

Microchip Technology Drawing C04-25665 Rev A

SY75608 数据表(PDF) 36 Page - Microchip Technology

SY75608 数据表(HTML) 36 Page - Microchip Technology

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