SY75608 datasheet(39/44 Pages) MICROCHIP

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2021 - 2023 Microchip Technology Inc. and its subsidiaries

DS20006363D-page 39

SY75608/612

APPENDIX A: REVISION HISTORY

Revision A (February 2021)

• Initial release of SY75608/612 as Microchip data

sheet DS20006363A.

Revision B (August 2022)

• Replaced 48-lead VQFN (6MX) package outline

drawing with 48-lead VQFN (6LX) package out-

line drawing.

• Replaced 56-lead VQFN (MEC) package outline

drawing with 56-lead VQFN (K3C) package out-

line drawing.

• Updated the Product Identification System section

to remove Wettable Flank from both package

options.

• Updated the Package Marking Information draw-

ing.

• Updated values for Output Enable and Disable

Time in the Output Electrical Characteristics table.

• Updated max value for Input Leakage Current for

OE Inputs in the Electrical Characteristics table.

Revision C (January 2023)

• Update values in the Electrical Characteristics,

Crystal Oscillator Characteristics, Output Electri-

cal Characteristics, and Jitter and Phase Noise

tables.

• Added I2C Bus Electrical Characteristics table.

• Removed Preliminary from the footer.

• Added content relevant to PCIe Gen 6.0 through-

out document.

Revision D (October 2023)

• Updated Silicon Revision Number in Table 6-2 to

“0010”.

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