2

LM61

SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016

www.ti.com

Product Folder Links: LM61

Submit Documentation Feedback

Copyright © 1999–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 3

6.1

Absolute Maximum Ratings ...................................... 3

6.2

ESD Ratings.............................................................. 3

6.3

Recommended Operating Conditions ....................... 3

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 4

6.6

Typical Characteristics .............................................. 5

7

Detailed Description .............................................. 7

7.1

Overview ................................................................... 7

7.2

Functional Block Diagram ......................................... 7

7.3

Feature Description................................................... 7

7.4

Device Functional Modes.......................................... 7

8

Application and Implementation .......................... 8

8.1

Application Information.............................................. 8

8.2

Typical Applications .................................................. 8

9

Power Supply Recommendations ...................... 11

10

Layout................................................................... 11

10.1

Layout Guidelines ................................................. 11

10.2

Layout Examples................................................... 11

10.3

Thermal Considerations ........................................ 12

11

Device and Documentation Support ................. 14

11.1

Related Documentation......................................... 14

11.2

Receiving Notification of Documentation Updates 14

11.3

Community Resources.......................................... 14

11.4

Trademarks ........................................................... 14

11.5

Electrostatic Discharge Caution ............................ 14

11.6

Glossary ................................................................ 14

12

Mechanical, Packaging, and Orderable

Information ........................................................... 14

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision I (February 2013) to Revision J

Page

•

Added Device Information table, Device Comparison Table, Pin Configuration and Functions section, Specifications

section, ESD Ratings table, Detailed Description section, Application and Implementation section, Power Supply

Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,

Packaging, and Orderable Information section ...................................................................................................................... 1

•

Added Thermal Information table ........................................................................................................................................... 4

•

Changed RθJA values for DBZ (SOT-23) From: 450°C/W To: 286.3°C/W and for LP (TO-92) From: 180°C/W To:

162.2°C/W .............................................................................................................................................................................. 4

Changes from Revision H (February 2013) to Revision I

Page

•

Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1