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LM61

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SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016

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Copyright © 1999–2016, Texas Instruments Incorporated

(1)

Part soldered to 30 gauge wire.

(2)

Heat sink used is 1/2 in.2 printed -circuit board with 2-oz foil with part attached as shown in Figure 18.

(3)

Part glued and leads soldered to 1 in.2 of 1/16 in. printed circuit board with 2-oz foil or similar.

Table 2. Temperature Rise of LM61 Due to Self-Heating and Thermal Resistance

(RθJA)

RθJA (°C/W)

TJ – TA (°C)

SOT-23

No heat sink(1)

Still air

450

0.26

Moving air

—

—

Small heat fin(2)

Still air

260

0.13

Moving air

180

0.09

TO-92

No heat sink(1)

Still air

180

0.09

Moving air

90

0.05

Small heat fin(3)

Still air

140

0.07

Moving air

70

0.03

Table 3. Temperature and Typical VO Values

TEMPERATURE

VO(TYPICAL)

100°C

1600 mV

85°C

1450 mV

25°C

850 mV

0°C

600 mV

–25°C

350 mV

–30°C

300 mV