LMH6523

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SNOSC88 – DECEMBER 2012

ABSOLUTE MAXIMUM RATINGS

(1)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for

availability and specifications.

VALUE

UNIT

Human Body Model

2

kV

ESD Tolerance (2)

Machine Model

200

V

Charged Device Model

750

V

Positive Supply Voltage (Pin 3)

–0.6 to 5.5

V

Differential Voltage between Any Two Grounds

<200

mV

Analog Input Voltage Range

–0.6 to 5.5

V

Digital Input Voltage Range

–0.6 to 5.5

V

Output Short circuit Duration (one pin to ground)

Infinite

Junction Temperature

150

°C

Storage Temperature Range

–65 to 150

°C

Soldering Information Infrared or Convection (30 sec)

260

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For specified specifications, see the Electrical

Characteristics tables.

(2)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

RECOMMENDED OPERATING CONDITIONS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply Voltage (Pin 3)

4.75

5.25

V

Differential Voltage Between Any Two Grounds

<10

mV

Analog Input Voltage Range, AC Coupled

0

V+

V

Temperature Range (2)

–40

85

°C

Package Thermal Resistance (3)

(

θJA)

(

θJC)

54 pin WQFN

23

4.7

°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For specified specifications, see the Electrical

Characteristics tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

(3)

Junction to ambient (

θJA) thermal resistance measured on JEDEC 4 layer board. Junction to case (θJC) thermal resistance measured at

exposed thermal pad; package is not mounted to any PCB.

ELECTRICAL CHARACTERISTICS - 5V

(1) (2)

The following specifications apply for single supply with V+ = 5V, Maximum Gain (0 Attenuation), RL = 200Ω, VOUT = 4VPPD,

fin = 200 MHz, High Power Mode, Boldface limits apply at temperature extremes.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

DYNAMIC PERFORMANCE

3dBBW

−3dB Bandwidth

VOUT = 2 VPPD

1.4

GHz

Output Noise Voltage

Source = 100

Ω

30

nV/

√Hz

NF

Noise Figure

Source = 100

Ω

8.5

dB

f = 100 MHz, VOUT = 4 dBm per tone

53

OIP3

Output Third Order Intercept Point

dBm

f = 200 MHz, VOUT = 4 dBm per tone

49

Output Second Order Intercept

POUT= 4 dBm per Tone, f1 =101 MHz,

OIP2

78

dBm

Point

f2=203 MHz

(1)

Electrical Table values apply only for factory testing conditions at the temperature indicated. No guarantee of parametric performance is

indicated in the electrical tables under conditions different than those tested

(2)

Negative input current implies current flowing out of the device.

Copyright © 2012, Texas Instruments Incorporated

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