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PACKAGE OUTLINE

C

54X 0.3

0.2

3.51±0.1

50X 0.5

54X 0.5

0.3

0.8 MAX

2X

8.5

7.5±0.1

2X 4

A

10.1

9.9

B

5.6

5.4

0.3

0.2

0.5

0.3

(0.1)

4214993/A 07/2013

WQFN

NJY0054A

WQFN

PIN 1 INDEX AREA

SEATING PLANE

1

18

28

45

19

27

54

46

0.1

C A

B

0.05

C

(OPTIONAL)

PIN 1 ID

DETAIL

SEE TERMINAL

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 2.000

DETAIL

OPTIONAL TERMINAL

TYPICAL