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SN74LVC1G80

SCES221S – APRIL 1999 – REVISED NOVEMBER 2016

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Copyright © 1999–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ..................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 5

6.6

Timing Requirements: TA = –40°C to +85°C ............ 6

6.7

Timing Requirements: TA = –40°C to +125°C .......... 6

6.8

Switching Characteristics: TA = –40°C to +85°C, CL =

15 pF .......................................................................... 7

6.9

Switching Characteristics: TA = –40°C to +85°C, CL =

30 pF or 50 pF ........................................................... 7

6.10

Switching Characteristics: TA = –40°C to +125°C,

CL = 30 pF or 50 pF................................................... 7

6.11

Operating Characteristics........................................ 7

6.12

Typical Characteristics ............................................ 8

7

Parameter Measurement Information .................. 9

8

Detailed Description ............................................ 11

8.1

Overview ................................................................. 11

8.2

Functional Block Diagram ....................................... 11

8.3

Feature Description................................................. 11

8.4

Device Functional Modes........................................ 11

9

Application and Implementation ........................ 12

9.1

Application Information............................................ 12

9.2

Typical Application ................................................. 12

10

Power Supply Recommendations ..................... 14

11

Layout................................................................... 14

11.1

Layout Guidelines ................................................. 14

11.2

Layout Example .................................................... 14

12

Device and Documentation Support ................. 15

12.1

Documentation Support ........................................ 15

12.2

Receiving Notification of Documentation Updates 15

12.3

Community Resources.......................................... 15

12.4

Trademarks ........................................................... 15

12.5

Electrostatic Discharge Caution ............................ 15

12.6

Glossary ................................................................ 15

13

Mechanical, Packaging, and Orderable

Information ........................................................... 15

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision R (December 2013) to Revision S

Page

•

Added Applications section, Device Information table, ESD Ratings table, Thermal Information table, Typical

Characteristics section, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1

•

Added max junction temperature to the Recommended Operating Conditions table ........................................................... 5

•

Added operating free-air temperature for YZP package to the Recommended Operating Conditions table ........................ 5

•

Changed RθJA value for DBV package from: 206°C/W to: 243.4°C/W ................................................................................... 5

•

Changed RθJA value for DCK package from: 252°C/W to: 278.9°C/W ................................................................................... 5

•

Changed RθJA value for YZP package from: 132°C/W to: 136.9°C/W.................................................................................... 5

Changes from Revision Q (January 2007) to Revision R

Page

•

Updated document to new TI data sheet format. ................................................................................................................... 1

•

Removed Ordering Information table. .................................................................................................................................... 1

•

Updated Ioff in Features. ......................................................................................................................................................... 1

•

Updated operating temperature range. .................................................................................................................................. 4

•

Added ESD warning ............................................................................................................................................................ 15