SN74LVC2G34

SCES359J – AUGUST 2001 – REVISED OCTOBER 2015

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6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

2500

Electrostatic

V(ESD)

V

discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

(1)

MIN

MAX

UNIT

Operating

1.65

5.5

VCC

Supply voltage

V

Data retention only

1.5

VCC = 1.65 V to 1.95 V

0.65 × VCC

VCC = 2.3 V to 2.7 V

1.7

VIH

High-level input voltage

V

VCC = 3 V to 3.6 V

2

VCC = 4.5 V to 5.5 V

0.7 × VCC

VCC = 1.65 V to 1.95 V

0.35 × VCC

VCC = 2.3 V to 2.7 V

0.7

VIL

Low-level input voltage

V

VCC = 3 V to 3.6 V

0.8

VCC = 4.5 V to 5.5 V

0.3 × VCC

VI

Input voltage

0

5.5

V

VO

Output voltage

0

VCC

V

VCC = 1.65 V

–4

VCC = 2.3 V

–8

IOH

High-level output current

–16

mA

VCC = 3 V

–24

VCC = 4.5 V

–32

VCC = 1.65 V

4

VCC = 2.3 V

8

IOL

Low-level output current

16

mA

VCC = 3 V

24

VCC = 4.5 V

32

VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V

20

Δt/Δv

Input transition rise or fall rate

VCC = 3.3 V ± 0.3 V

10

ns/V

VCC = 5 V ± 0.5 V

5

DBV, DCK, DRL Package

–40

125

TA

Operating free-air temperature

°C

YZP Package

-40

85

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Semiconductor and Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

SN74LVC2G34

THERMAL METRIC(1)

DBV (SOT-23)

DCK (SC70)

DRL (SOT)

YZP (DSBGA)

UNIT

6 PINS

6 PINS

6 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

165

259

142

123

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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