150

TMP708

VCC

GND

HYST

SET

OT

Microprocessor

VCC

GND

RSET

470 k

2.7 V to 5.5 V

0.1 …F

Copyright © 2016, Texas Instruments Incorporated

9

TMP708-Q1

www.ti.com

SBOS828 – DECEMBER 2016

Product Folder Links: TMP708-Q1

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Copyright © 2016, Texas Instruments Incorporated

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TMP708-Q1 device is simple to configure. The only external components that the device requires are a

bypass capacitor and pullup resistor. Power-supply bypassing is strongly recommended. Use a 0.1-µF capacitor

placed as close as possible to the VCC supply pin. To minimize the internal power dissipation of the TMP708-Q1

family of devices, use a pullup resistor value greater than 10 kΩ from the OT pin to the VCC pin. See the

Hysteresis Input section for hysteresis configuration, and the Set-Point Resistor (RSET) section for configuring the

temperature threshold.

8.2 Typical Application

Figure 5. Overtemperature Protection for a 60°C Trip Point

8.2.1 Design Requirements

For this design example, a 2.7-V to 5.5-V power supply, 60°C trip point, and 10°C hysteresis are used.