SET

GND

OT

VCC

HYST

0.1 …F

RSET

VIA to ground plane

VIA to power plane

150

11

TMP708-Q1

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SBOS828 – DECEMBER 2016

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9 Power Supply Recommendations

The TMP708-Q1 low supply current and supply range allow this device to be powered from many sources. Any

significant noise on the VCC pin can result in a trip-point error. Minimize this noise by low-pass filtering the

device supply (VCC) using a 150-Ω resistor and a 0.1-μF capacitor.

10 Layout

10.1 Layout Guidelines

The TMP708-Q1 is extremely simple to lay out. Figure 7 shows the recommended board layout.

10.2 Layout Example

Figure 7. Recommended Layout

10.3 Thermal Considerations

The TMP708-Q1 quiescent current is typically 40 μA. The device dissipates negligible power when the output

drives a high-impedance load. Thus, the die temperature is the same as the package temperature. In order to

maintain accurate temperature monitoring, provide a good thermal contact between the TMP708-Q1 package

and the device being monitored. The rise in die temperature as a result of self-heating is given by Equation 2:

ΔTJ = PDISS × θJA

where

•

PDISS = power dissipated by the device.

•

θJA = package thermal resistance. Typical thermal resistance for SOT-23 package is 217.9°C/W.

(2)

To limit the effects of self-heating, keep the output current at a minimum level.