ISL2100A, ISL2101A

FN6294 Rev 4.2

Page 3 of 11

Oct 17, 2023

Ordering Information

PART NUMBER (Note)

PART

MARKING

PACKAGE DESCRIPTION

(RoHS Compliant)

PKG.

DWG. #

CARRIER TYPE

(Note 1)

TEMP. RANGE

ISL2100AAR3Z

00AZ

9 Ld 3x3 DFN

L9.3x3

Tube

-40 to +125°C

ISL2100AAR3Z-T

Reel, 6k

ISL2101AAR3Z

01AZ

Tube

ISL2101AAR3Z-T

Reel, 6k

ISL2101AABZ

01ABZ

8 Ld SOIC

M8.15

Tube

ISL2101AABZ-T

Reel, 2.5k

NOTES:

1. See TB347 for details on reel specifications.

2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin

plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free

products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), see the ISL2100A and ISL2101A device pages. For more information about MSL, see TB363.

Pinouts

(9 LD DFN)

TOP VIEW

(8 LD SOIC)

TOP VIEW

2

3

1

4

8

7

6

9

5

VDD

HB

HO

HS

LO

VSS

LI

HI

NC

EPAD

5

6

8

7

4

3

2

1

VDD

HB

HO

HS

LO

LI

HI

VSS

NOTE: EPAD = Exposed PAD.

Pin Descriptions

SYMBOL

DESCRIPTION

VDD

Positive supply to lower gate driver. Bypass this pin to VSS.

HB

High-side bootstrap supply. External bootstrap capacitor is required. Connect positive side of bootstrap capacitor to this pin.

Bootstrap diode is on-chip.

HO

High-side output. Connect to gate of high-side power MOSFET.

HS

High-side source connection. Connect to source of high-side power MOSFET. Connect negative side of bootstrap capacitor to this

pin.

HI

High-side input.

LI

Low-side input.

VSS

Chip negative supply, which will generally be ground.

LO

Low-side output. Connect to gate of low-side power MOSFET.

EPAD

Exposed pad. Connect to ground or float. The EPAD is electrically isolated from all other pins.