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FN6294 数据表(PDF) 9 Page - Renesas Technology Corp

部件名 FN6294
功能描述  100V, 2A Peak, High Frequency Half-Bridge Drivers
PDF  12 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  RENESAS [Renesas Technology Corp]
网页  http://www.renesas.com
标志 RENESAS - Renesas Technology Corp

FN6294 数据表(HTML) 9 Page - Renesas Technology Corp

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ISL2100A, ISL2101A
FN6294 Rev 4.2
Page 9 of 11
Oct 17, 2023
FIGURE 21. BOOTSTRAP DIODE I-V CHARACTERISTICS
FIGURE 22. VHS VOLTAGE vs VDD VOLTAGE
Typical Performance Curves (Continued)
0.3
0.4
0.5
0.6
0.7
0.
1 .10
-6
1 .10
-5
1 .10
-4
1 .10
-3
0.01
0.1
1
FORWARD VOLTAGE (V)
12
13
14
15
16
0
20
40
60
80
100
120
VDD to VSS VOLTAGE (V)
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision
.
DATE
REVISION
CHANGE
Oct 17, 2023
4.2
Updated M8.15 POD to the latest revision (corrected typo).
Jul 22, 2021
4.1
Updated external links throughout.
Updating Ordering Information table format, removed retired part, corrected typo for SOIC package.
Updated SOIC Thermal Information as follows:
-Changed Theta JA from 120 to 107
-Changed Theta JC from N/A to 50
-Added Notes 8 and 9 and referenced them to SOIC thermals.
Removed About Intersil
Updated POD L9.3x3 to the latest revision, changes are as follows:
-Updated to new format with dimensions included. Also added a PCB land pattern.
Added latest version of POD M8.15.
Dec 8, 2015
4.0
- Updated Ordering Information Table on page 3.
- Added Revision History.
- Added About Intersil Verbiage.
- Updated POD L9.3X3 to latest revision changes are as follow:
Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends)..
- Updated POD M8.15 to latest revision changes are as follow:
Changed Note 1 "1982" to "1994"
Changed in Typical Recommended Land Pattern the following:
2.41(0.095) to 2.20(0.087)
0.76 (0.030) to 0.60(0.023)
0.200 to 5.20(0.205)
Updated to new POD format by removing table and moving dimensions onto
drawing and adding land pattern.



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