Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Description (cont.)...........................................................3

6 Pin Configuration and Functions...................................3

7 Specifications.................................................................. 4

7.1 Absolute Maximum Ratings........................................ 4

7.2 ESD Ratings............................................................... 4

7.3 Recommended Operating Conditions.........................4

7.4 Thermal Information....................................................5

7.5 Supply Current............................................................ 5

7.6 Internal 1.8-V LDO (REG18).......................................5

7.7 I/O (PULS, INT)...........................................................5

7.8 Chip Enable (CE)........................................................ 5

7.9 Internal Temperature Sensor...................................... 6

7.10 NTC Thermistor Measurement Support....................6

7.11 Coulomb Counter (CC)............................................. 6

7.12 Analog Digital Converter (ADC)................................ 6

7.13 Internal Oscillator Specifications...............................7

7.14 Voltage Reference1 (REF1)......................................7

7.15 Voltage Reference2 (REF2)......................................7

7.16 Flash Memory........................................................... 7

7.17 I2C I/O....................................................................... 7

7.18 I2C Timing — 100 kHz.............................................. 8

7.19 I2C Timing — 400 kHz.............................................. 8

7.20 HDQ Timing.............................................................. 8

7.21 Typical Characteristics............................................ 10

8 Detailed Description...................................................... 11

8.1 Overview................................................................... 11

8.2 Functional Block Diagram......................................... 11

8.3 Feature Description...................................................11

8.4 Device Functional Modes..........................................13

9 Applications and Implementation................................ 14

9.1 Application Information............................................. 15

9.2 Typical Applications.................................................. 15

10 Power Supply Requirements......................................17

11 Layout........................................................................... 18

11.1 Layout Guidelines................................................... 18

11.2 Layout Example...................................................... 19

12 Device and Documentation Support..........................20

12.1 Documentation Support.......................................... 20

12.2 Receiving Notification of Documentation Updates..20

12.3 Support Resources................................................. 20

12.4 Trademarks.............................................................20

12.5 Electrostatic Discharge Caution..............................20

12.6 Glossary..................................................................20

13 Mechanical, Packaging, Orderable Information....... 20

4 Revision History

Changes from Revision A (August 2019) to Revision B (December 2022)

Page

• Changed the Simplified Schematic ....................................................................................................................1

• Removed the CE reference from I/O section......................................................................................................5

• Added Chip Enable (CE), which includes CE pin thresholds that are assured by design.................................. 5

Changes from Revision * (March 2019) to Revision A (August 2019)

Page

• Changed body size in Device Information ......................................................................................................... 1

BQ27Z561-R1

SLUSDH5B – MARCH 2019 – REVISED DECEMBER 2022

www.ti.com

2

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: BQ27Z561-R1